SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Jun 1, 2023
app pub date -
Sep 9, 2022
filing date -
Nov 29, 2021
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Abstract
A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.
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