INDIRECT EVAPORATIVE COOLING APPARATUS AND COOLING SYSTEM INCLUDING THE SAME

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United States of America Patent

APP PUB NO 20230168042A1
SERIAL NO

18071891

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Abstract

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The present disclosure relates to an indirect evaporative cooling apparatus and a cooling system including the same, and more particularly, to an indirect evaporative cooling apparatus including a plurality of evaporation modules each including a first module and a second module, and a cooling system including the same. According to the present disclosure, it is possible to provide an indirect evaporative cooling device that maximizes cooling efficiency and space efficiency, and a cooling system including the same.

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Patent Owner(s)

Patent OwnerAddress
KOREA INSTITUTE OF MACHINERY & MATERIALSDAEJEON 34103

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Dong Ho Sejong-si, KR 120 523
KIM, Jungchul Daejeon, KR 56 526
KIM, Young Daejeon, KR 170 2327
YOON, Seok Ho Daejeon, KR 29 171

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