DUAL LOOP BLENDED COOLING
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United States of America Patent
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Issued Date -
Jun 1, 2023
app pub date -
Oct 20, 2022
filing date -
Nov 30, 2021
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status (Latency Note)
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Abstract
A thermal management system includes a refrigerant loop including a compressor, a condenser, an expansion element, and a chiller. A first coolant loop of the thermal management system includes the chiller, a first cooling heat exchanger disposed downstream of the chiller, and a distribution valve disposed downstream of the first cooling heat exchanger. A coolant flow path branches from the first coolant loop with the coolant flow path extending from the distribution valve to a re-entry point where the coolant flow path rejoins the first coolant loop at a position downstream of the distribution valve. The coolant flow path includes an electric component, and the distribution valve is configured to control a distribution of the first coolant flowing towards the electric component and the re-entry point.
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