METHODS FOR DISPENSING AND FORMING 3A MOLECULAR SIEVE HOT MELT ENTRAINED POLYMERS ONTO SUBSTRATES

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United States of America Patent

APP PUB NO 20230166440A1
SERIAL NO

18160397

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Abstract

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Disclosed are methods for forming and adhering an entrained polymer structure to a substrate. The methods include providing a substrate configured to receive application of a molten entrained polymer. A 3 A molecular sieve entrained polymer in molten form is applied in a predetermined shape, to a surface of the substrate, to form a solidified entrained polymer structure on the substrate. The entrained polymer includes a monolithic material formed of at least a base polymer and 3 A molecular sieve. The surface of the substrate is compatible with the molten entrained polymer so as to thermally bond with it. In this way, the entrained polymer bonds to the substrate and solidifies upon sufficient cooling of the entrained polymer.

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Patent Owner(s)

Patent OwnerAddress
CSP TECHNOLOGIES INC960 WEST VETERANS BOULEVARD AUBURN AL 36832

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Freedman, Jonathan R Auburn, US 47 577
Myers, Kasey Auburn, US 10 20
Spano, William Frederick Auburn, US 10 45

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