CIRCUIT SUBSTRATE AND MOUNTED SUBSTRATE
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United States of America Patent
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Issued Date -
May 25, 2023
app pub date -
Nov 21, 2022
filing date -
Nov 25, 2021
priority date (Note) -
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Abstract
A circuit substrate is a circuit substrate having at least one pair of terminals, wherein a bonding material containing a metal element is disposed above the terminals, the pair of terminals and the bonding material are disposed inside a wall formed by an insulator, and the wall has an uneven portion on an inner side surface.
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