METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
May 25, 2023
app pub date -
Jan 25, 2023
filing date -
Jul 31, 2020
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Abstract
A method for manufacturing a semiconductor device provided with a semiconductor chip includes: disposing the semiconductor chip such that an electrode of the semiconductor chip is abutted against a peeling portion provided on a substrate; forming an anchor portion, which defines a position of the semiconductor chip and has flexibility so as to be freely bendable, such that the anchor portion covers the peeling portion and the semiconductor chip; forming a sealing portion that is abutted against the anchor portion and has flexibility so as to be freely bendable; and separating the peeling portion and the substrate from the semiconductor chip and the anchor portion and exposing the electrode of the semiconductor chip. The anchor portion is formed by at least one of a vapor phase deposition method, a spray coating method, and an inkjet method.
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