METHOD FOR GRINDING SEMICONDUCTOR WAFERS
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United States of America Patent
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Issued Date -
May 25, 2023
app pub date -
Apr 12, 2021
filing date -
Apr 23, 2020
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Abstract
A method grinds a semiconductor wafer by treating the semiconductor wafer so as to remove material by way of a grinding tool containing grinding teeth having a height h, with a coolant being supplied into a contact region between the semiconductor wafer and the grinding tool, in which, at any time of the grinding, a flushing fluid is applied onto a region on one side of the semiconductor wafer by way of a nozzle.
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