CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
May 18, 2023
app pub date -
Jan 13, 2023
filing date -
Jan 13, 2023
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Abstract
A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.
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