FILM FOR MANUFACTURING ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
May 18, 2023
app pub date -
Jun 2, 2022
filing date -
Jun 2, 2022
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Abstract
A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.
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