METHOD FOR TREATING A WOOD SUBSTRATE
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United States of America Patent
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Issued Date -
May 18, 2023
app pub date -
Nov 15, 2021
filing date -
Nov 15, 2021
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Abstract
A method for treating a wood substrate is provided. The method comprises contacting the wood substrate in a field application with an aqueous composition. The contacting is performed at a pressure of less than 20 psia. The aqueous composition comprises, by total weight of the aqueous composition, 1.0% to 10.0% by weight of a micronized basic copper carbonate, 0.35% to 2.5% by weight of a quaternary ammonium compound, and at least 80% by weight of water.
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