PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING WIRING BOARD

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United States of America Patent

APP PUB NO 20230145264A1
SERIAL NO

17913016

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Abstract

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A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, in which the binder polymer contains a polymer (a) having a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit and having a content of the styrene or styrene derivative unit of 40% by mass or more.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 ?1057325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRAYAMA, Yuya Tokyo, JP 10 0
ONO, Keishi Tokyo, JP 14 20
SUNOHARA, Seiji Tokyo, JP 4 7
YAMASHITA, Tetsuro Tokyo, JP 14 75

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