Semiconductor package having an interdigitated mold arrangement
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United States of America Patent
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Mar 26, 2024
Grant Date -
May 4, 2023
app pub date -
Oct 29, 2021
filing date -
Oct 29, 2021
priority date (Note) -
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Abstract
A semiconductor package including a leadframe has a plurality of leads, and a semiconductor die including bond pads attached to the leadframe with the bond pads electrically coupled to the plurality of leads. The semiconductor die includes a substrate having a semiconductor surface including circuitry having nodes coupled to the bond pads. A mold compound encapsulates the semiconductor die. The mold compound is interdigitated having alternating extended mold regions over the plurality of leads and recessed mold regions in between adjacent ones of the plurality of leads.
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