Component Embedded in Component Carrier and Having an Exposed Side Wall
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United States of America Patent
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Issued Date -
May 4, 2023
app pub date -
Dec 28, 2022
filing date -
Aug 4, 2017
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Abstract
A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.
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