RAPID AND PRECISE TEMPERATURE CONTROL FOR THERMAL ETCHING
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United States of America Patent
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Issued Date -
Apr 27, 2023
app pub date -
Mar 23, 2021
filing date -
Apr 1, 2020
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Abstract
Apparatuses and methods are described. An apparatus may include a processing chamber including chamber walls, a chamber heater configured to heat the walls, a pedestal positioned within the chamber and including a substrate heater having a plurality of light emitting diodes (LEDs) configured to emit light with wavelengths in the range of 400 nanometers (nm) and 800 nm, a window positioned above the heater and having a material transparent to light with wavelengths in the range of 400 nm and 800 nm, and three or more substrate supports, each having a substrate support surface vertically offset from the window and configured to support a substrate such that the window and the substrate are offset by a nonzero distance.
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