MULTI CHIP HARDWARE SECURITY MODULE
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United States of America Patent
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Issued Date -
Apr 27, 2023
app pub date -
Oct 22, 2021
filing date -
Oct 22, 2021
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Abstract
A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.
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