Attachment of Stress Sensitive Integrated Circuit Dies
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United States of America Patent
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Issued Date -
Apr 27, 2023
app pub date -
Dec 12, 2022
filing date -
Nov 17, 2017
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Abstract
In an embodiment, a semiconductor package includes a support and a stack of two or more semiconductor dies, the stack including an upper die and further including a lower die attached to the support by adhesive on a backside of the lower die, wherein the adhesive covers only part of the backside of the lower die, and wherein the adhesive has a plurality of non-contiguous regions on the backside of the lower die.
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