IMAGE SENSOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230108974A1
SERIAL NO

18075323

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An image sensor device includes a semiconductor device, a plurality of photo sensitive regions, a dielectric layer, a grid structure, and a plurality of convex dielectric lenses. The photo sensitive regions are in the semiconductor substrate. The dielectric layer is over a backside surface of the semiconductor substrate. The grid structure is over a backside surface of the dielectric layer. The grid structure includes a plurality of grid lines. Each of the grid lines comprises a lower portion and an upper portion forming an interface with the lower portion. The convex dielectric lenses are alternately arranged with the grid lines over the backside surface of the dielectric layer. Apexes of the plurality of convex dielectric lenses are higher than an interface between the upper portion and the lower portion of each of the grid lines.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSINCHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JANGJIAN, Shiu-Ko Tainan City, TW 172 1310
LIN, Chun-Che Tainan City, TW 30 124
LIN, Yu-Ku Tainan City, TW 44 233
WU, Chih-Nan Tainan City, TW 26 327

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