ELECTRO-OPTIC MODULATOR, OPTICAL CHIP, AND INTEGRATED CHIP
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United States of America Patent
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Issued Date -
Apr 6, 2023
app pub date -
Nov 29, 2022
filing date -
May 30, 2020
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Abstract
An electro-optic modulator is disposed on a surface of a substrate including: an optical waveguide layer disposed on the substrate, a modulation electrode disposed on the optical waveguide layer, and a metal electrode disposed on the modulation electrode and electrically connected to the modulation electrode. A first end of the metal electrode is coupled to a radio frequency driver, and receives a modulation signal input by the radio frequency driver. The modulation electrode is configured to perform electro-optic modulation on the optical waveguide layer based on the modulation signal. A second end of the metal electrode is coupled to a direct-current voltage end, and the direct-current voltage end is configured to input a voltage signal and provide a bias voltage for the radio frequency driver by using the metal electrode. This reduces costs and a size of the electro-optic modulator, and is conducive to device miniaturization.
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