IMAGING UNIT, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
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United States of America Patent
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Issued Date -
Apr 6, 2023
app pub date -
Nov 30, 2022
filing date -
Apr 9, 2018
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Abstract
Provided is an imaging unit more efficiently manufacturable with high dimensional precision. The imaging unit includes: a sensor board including an imaging device, in which the imaging device has a plurality of pixels and allows generation of a pixel signal by receiving outside light in each of the plurality of pixels; a bonding layer including an inorganic insulating material; and a circuit board including a circuit chip and an organic insulating layer, in which a circuit chip has a signal processing circuit that performs signal processing for the pixel signal and is bonded to the sensor board through the bonding layer, and the organic insulating layer covers a vicinity of the circuit chip.
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