INTERPOSER AND SUBSTRATE MODULE
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United States of America Patent
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Issued Date -
Apr 6, 2023
app pub date -
Dec 14, 2022
filing date -
Jul 2, 2020
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Abstract
In an interposer, metal bodies are included in a resin layer and separated from each other. A dimension of each of the metal bodies in an upward-downward direction is greater than a dimension of each of the plurality of metal bodies in a direction orthogonal to the upward-downward direction. At least one of the metal bodies is located in a first electrode and at least one of the plurality of metal bodies is located in a second electrode to electrically couple together the first electrode and the second electrode.
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