Sensor Arrangement and Method for Producing a Sensor Arrangement
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United States of America Patent
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Apr 6, 2023
app pub date -
Dec 1, 2021
filing date -
Dec 17, 2020
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Abstract
In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.
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