BONDED STRUCTURE

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United States of America Patent

APP PUB NO 20230098430A1
SERIAL NO

17948318

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATIONKARIYA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HANDA, Taiga Morioka-city, JP 2 1
MIYANO, Hirotaka Kariya-city, JP 4 1
MORI, Katsuhito Morioka-city, JP 8 42
MORI, Kunio Morioka-city, JP 49 838
MORITA, Kazuhiro Kariya-city, JP 26 352
SAITO, Masami Kariya-city, JP 33 478

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