Metal Body, Fitting Connection Terminal, and Method for Forming Metal Body

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United States of America Patent

APP PUB NO 20230094946A1
SERIAL NO

17800714

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a metal body that can be manufactured easily while whisker generation resulting from external stress is suppressed, a fitting connection terminal, and a method for forming the metal body. The metal body includes a barrier layer containing Ni as a main component formed on a metal substrate containing Cu as a main component, and a metal plating layer containing Sn as a main component formed directly on the barrier layer. An area ratio that is a ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to a cross section of the metal plating layer is 20% or less in the cross section of the metal body.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTD23 CHIZUQIAOCHO DUZULI DISTRICT TOKYO JAPAN TOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwamoto, Hiroyuki Tokyo, JP 24 203
Kondoh, Shigeki Tokyo, JP 7 11
Munekata, Osamu Tokyo, JP 19 105
Nakamura, Katsuji Tokyo, JP 22 598
Tsuchiya, Masato Tokyo, JP 43 208
Tsuruta, Kaichi Tokyo, JP 25 199

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