PREPARATION METHOD FOR ULTRAHIGH-CONDUCTIVITY MULTILAYER SINGLE-CRYSTAL LAMINATED COPPER MATERIAL, AND COPPER MATERIAL
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United States of America Patent
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Mar 16, 2023
app pub date -
Sep 4, 2020
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Feb 27, 2020
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Abstract
Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.
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