BONDED BODY AND A METHOD OF PRODUCING THE SAME

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United States of America Patent

APP PUB NO 20230074173A1
SERIAL NO

18048951

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Abstract

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A bonded body has a supporting substrate composed of silicon, a piezoelectric material substrate, and a bonding layer provided on a surface of the supporting substrate and composed of silicon oxide. The bonding layer has a refractive index of 1.468 or higher and 1.474 or lower.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTDNAGOYA-SHI AICHI 467-8530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KAWASAKI, Takahiro Tajimi-City, JP 18 51
TOMIOKA, Takuya Minamitsuru-District, JP 5 10

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