Phenolic resin foam laminate board
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United States of America Patent
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Mar 19, 2024
Grant Date -
Mar 9, 2023
app pub date -
Feb 5, 2021
filing date -
Feb 6, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10−3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.
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