DEVICE AND METHOD FOR OPTIMIZING CONTROL PARAMETER OF SOLDER PRINTING APPARATUS
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United States of America Patent
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Issued Date -
Mar 9, 2023
app pub date -
May 31, 2021
filing date -
May 29, 2020
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status (Latency Note)
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Abstract
An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more processors may be configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield.
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