OPTICAL PROXIMITY CORRECTION METHOD, MASK MANUFACTURING METHOD AND SEMICONDUCTOR CHIP MANUFACTURING METHOD USING THE SAME
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United States of America Patent
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Issued Date -
Mar 9, 2023
app pub date -
May 9, 2022
filing date -
Sep 6, 2021
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Abstract
A method of manufacturing a semiconductor chip includes designing a layout for a semiconductor chip, performing an optical proximity correction (OPC) on the layout, manufacturing a mask after performing the OPC, and manufacturing the semiconductor chip using the mask, wherein a plurality of OPC shapes corresponding to a rectangular pattern of the mask are included in the mask and at least one of the plurality of OPC shapes includes a multi-edge corner rounding OPC shape.
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