High Density Coil Design And Process

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230071114A1
SERIAL NO

17985715

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

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Patent Owner(s)

Patent OwnerAddress
HUTCHINSON TECHNOLOGY INCORPORATEDHUTCHINSON MN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cravens, Forrest A Hutchinson, US 2 3
German, Nole D Hutchinson, US 9 203
Jelkin, Duane M Hutchinson, US 8 98
Johnson, Trent A Hutchinson, US 8 84
Lang, Matthew S Excelsior, US 10 14
Peter, Todd A Darwin, US 3 5
Pokornowski, Zachary A Cokato, US 24 338
Ruzicka, Ryan N Waconia, US 28 291
Schumann, John L Litchfield, US 14 176

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