METHOD AND SYSTEM FOR PROCESSING WAFER
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United States of America Patent
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Issued Date -
Mar 2, 2023
app pub date -
Aug 30, 2021
filing date -
Aug 30, 2021
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Abstract
The present disclosure provides a method and a system therefore for processing wafer. The method includes: extracting a first gas from a chamber via a first route; blocking a second route used to be pumped down to chuck a wafer placed in the chamber, wherein the second route connects the chamber and the first route; and providing a second gas via a third route to purge a junction of the first route and the second route.
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