SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Mar 2, 2023
app pub date -
Jun 29, 2022
filing date -
Aug 27, 2021
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Abstract
A semiconductor package capable of reducing or preventing cracks from occurring in a conductive bump and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a first conductive bump; a first re-distribution layer which is provided between the semiconductor chip and the first conductive bump and electrically connects the semiconductor chip and the first conductive bump; and a buffer structure which formed to fill up a space between a side surface of the first conductive bump and one surface of the first re-distribution layer, in which the buffer structure includes a plurality of pores.
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