METHOD FOR PRODUCING A MICROELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Mar 2, 2023
app pub date -
Mar 25, 2021
filing date -
Apr 20, 2020
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Abstract
A method for producing a microelectronic device, in particular a MEMS chip device, comprising at least one carrier substrate. At least one electrodynamic actuator made of a metal conductor formed at least largely of copper is applied to the carrier substrate in at least one method step. At least one piezoelectric actuator is applied to the carrier substrate in at least one further method step.
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