Intelligent Wafer-Level Testing of Photonic Devices
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United States of America Patent
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Issued Date -
Mar 2, 2023
app pub date -
Sep 1, 2021
filing date -
Sep 1, 2021
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Abstract
A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.
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