METHOD FOR FORMING DIAMOND PRODUCT
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United States of America Patent
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Issued Date -
Feb 23, 2023
app pub date -
Mar 4, 2021
filing date -
Mar 4, 2021
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Abstract
A method for forming a diamond product. Diamond material is provided and a damage layer comprising sp2 bonded carbon is formed in the material. The presence of the damage layer defines a first diamond layer above and in contact with the damage layer and a second diamond layer below and in contact with the damage layer. The damage layer is electrochemically etched to separate it from the first layer, wherein the electrochemical etching is performed in a solution containing ions, the solution having an electrical conductivity of at least 500 μS cm−1, and wherein the ions are capable of forming radicals during electrolysis. The diamond product is also described.
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