Ceramic carrier substrate and power module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12028974
APP PUB NO 20230051374A1
SERIAL NO

17789124

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Abstract

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A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.

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Patent Owner(s)

Patent OwnerAddress
ROBERT BOSCH GMBHPOSTFACH 30 02 20 STUTTGART DE-70442

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tauber, Peter Tuebingen, DE 3 2
Weber, Josef Reutlingen, DE 30 205
Winkler, Ralf Reutlingen, DE 22 182

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