HEAT DISSIPATION APPARATUS AND ANTENNA ASSEMBLY USING THE SAME
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United States of America Patent
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Issued Date -
Feb 16, 2023
app pub date -
Oct 28, 2022
filing date -
Oct 28, 2022
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Abstract
A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.
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