METAL COMPONENT
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United States of America Patent
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Issued Date -
Feb 16, 2023
app pub date -
Jul 22, 2022
filing date -
Jul 22, 2022
priority date (Note) -
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Abstract
Provided is a metal component that is configured to be used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; and a noble metal plating layer formed on all or part of a surface of the substrate, wherein the noble metal plating layer has a surface with irregularities, and a protrusion of the irregularities has an aspect ratio of 0.3 or more.
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