METHOD OF PRODUCING COPPER-CONTAINING LAYER
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United States of America Patent
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Issued Date -
Feb 9, 2023
app pub date -
Dec 1, 2020
filing date -
Dec 1, 2020
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Abstract
Provided is a method of producing a copper-containing layer, including: step 1: a step of reducing a surface of a substrate, provided that a substrate having a surface formed of a silicic acid compound is excluded, through use of a reducing agent; and step 2: a step of forming a copper-containing layer on the surface having been reduced in the step 1 through use of a thin-film forming raw material containing a copper compound by a plasma atomic layer deposition method.
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