ENGINEERED WOOD PANEL WITH CONNECTIVITY LAYER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230030903A1
SERIAL NO

17879714

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An engineered wood product with at least one engineered-wood substrate or core layer (such as, but not limited to, OSB), with a connectivity layer configured to reflect RF signals (e.g., wifi and/or cellular signals), thereby enhancing connectivity in adjacent or proximate spaces or areas. The connectivity layer may be a metallic material, such as, but not limited to, aluminum or copper. The layer may be a sheet or film or foil of the metallic material applied to the surface(s), or integrated into the interior, of the substrate or core layer. The layer also may be a coating or deposited layer. A connectivity layer may be “sandwiched” between two or more engineered-wood substrates, thereby forming a composite panel or product. The surface of the connectivity layer may be embossed or patterned.

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Patent Owner(s)

Patent OwnerAddress
LOUISIANA PACIFIC CORPNASHVILLE TN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ESCOBEDO, LOUIS NASHVILLE, US 1 0
LINE, JARROD KEVIN BRENTWOOD, US 25 18
SCHMITZ, JESSE NASHVILLE, US 4 0
SUN, QINING NASHVILLE, US 6 2

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