SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM
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United States of America Patent
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Issued Date -
Jan 19, 2023
app pub date -
Sep 23, 2022
filing date -
Sep 23, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A solder cutting device includes a first holding part, a first drive part that feeds a tape-like solder material held by the first holding part in a first direction, a cutting part for cutting the tape-like solder material, and a second drive part that actuates the cutting part. The first drive part is a first actuator that is electrically-driven and that converts a rotational motion of a rotating body, the axis of which extends in the first direction, into a motion in the first direction. The second drive part includes a second actuator that moves a moving body in the first direction, and a connection portion that converts the motion of the moving body into a motion in a second direction and transmits the motion to the cutting part.
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