HEAT TRANSFER DEVICE

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United States of America Patent

APP PUB NO 20230010884A1
SERIAL NO

17779957

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat transfer device includes a first member and a first and second heat transfer element. In the first heat transfer element, a first contact area that is a contact area between the first heat transfer element and the first member varies. In the second heat transfer element, a second contact area that is a contact area between the second heat transfer element and the first member varies. The first contact area is greater when magnitude of a first external force applied to the first member is smaller than a first threshold than when the magnitude of the first external force is equal to or greater than the first threshold. The second contact area is smaller when the magnitude of the first external force is smaller than the first threshold than when the magnitude of the first external force is equal to or greater than the first threshold.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD1-61 SHIROMI 2-CHOME CHUO-KU OSAKA-SHI OSAKA 540-6207

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKAMURA, Tatsuya Osaka, JP 206 1881
NAKAMURA, Yoshitaka Osaka, JP 221 1744
OGIHARA, Yusuke Osaka, JP 7 3
SHII, Kentaro Osaka, JP 16 27

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