THERMAL MANAGEMENT SYSTEM FOR AN ELECTRIC COMPONENT
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United States of America Patent
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Issued Date -
Jan 5, 2023
app pub date -
Nov 18, 2020
filing date -
Nov 18, 2020
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Abstract
A thermal management system for an electric component has a housing for the electric component and a heat exchange plate extending over the surface of the lateral face of the housing. The plate has a fluid channel between a fluid inlet and a fluid outlet, a supply duct to supply the plate with fluid and a discharge duct, a casing defining the housing(s) and receiving the heat exchange plate and the supply and discharge ducts. The system includes a fluid collecting box arranged to collect fluid from a possible fluid leakage at the junction between the fluid inlet and the fluid outlet of the plate and the associated supply and discharge ducts, so as to prevent said leaked fluid from dripping into a bottom of the casing.
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