SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20220415884A1
SERIAL NO

17903113

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Abstract

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A semiconductor device includes a semiconductor substrate, a contact region, a carrier suppression region and an electrode. The semiconductor substrate is shared by an insulated gate bipolar transistor (IGBT) region with an IGBT element and a freewheeling diode (FWD) region with an FWD element. The carrier suppression region is exposed from a surface of the semiconductor substrate in the IGBT region, and has a lower impurity concentration than the contact region. The carrier suppression region has a Schottky barrier junction with the electrode.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATION1-1 SHOWA-CHO KARIYA-SHI AICHI 4488661 ?4488661

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
RAHMAN, Tasbir Toyota-city, JP 2 0
SUMITOMO, Masakiyo Kariya-city, JP 24 338
TORIYAMA, Shuichi Kariya-city, JP 14 132

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