ETCHANT COMPOSITION AND METHODS FOR MANUFACTURING METAL PATTERN AND ARRAY SUBSTRATE USING THE SAME
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United States of America Patent
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Issued Date -
Dec 29, 2022
app pub date -
Aug 26, 2022
filing date -
Aug 26, 2022
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Abstract
A method for manufacturing a metal pattern, the method including forming a photosensitive layer pattern on a multilayer metal substrate including titanium and copper; providing an etchant composition on the multilayer metal substrate on which the photosensitive layer pattern is formed to form the source electrode and the drain electrode; and removing the photosensitive layer pattern, wherein the etchant composition includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound, and water, and a weight ratio of the four-nitrogen ring compound and the two-chlorine compound is from about 1:0.5 to about 1:4.
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