SEMICONDUCTOR CHIP
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United States of America Patent
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Issued Date -
Dec 22, 2022
app pub date -
Aug 22, 2022
filing date -
Aug 22, 2022
priority date (Note) -
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Abstract
A semiconductor chip includes a substrate and a transistor. The transistor is formed on the substrate and includes an insulation layer and a fin. The fin includes a base portion and a protrusion connected with the base portion, wherein the protrusion is projected with respect to an upper surface of the base portion and has a recess recessed with respect to the upper surface.
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