HERMETICALLY SEALED GLASS PACKAGE
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United States of America Patent
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Issued Date -
Dec 22, 2022
app pub date -
Aug 19, 2022
filing date -
Aug 19, 2022
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Abstract
A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.
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