Magnetic-field melting solder, and joining method in which same is used
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United States of America Patent
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Issued Date -
Dec 22, 2022
app pub date -
Nov 18, 2020
filing date -
Nov 18, 2020
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Abstract
A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.
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