DIE SET AND PROCESSING METHOD USING DIE SET
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United States of America Patent
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Issued Date -
Dec 22, 2022
app pub date -
Mar 16, 2021
filing date -
Mar 16, 2021
priority date (Note) -
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Abstract
A die set capable of suppressing breakage or wrinkling of the workpiece during bending and a processing method using the die set. A die set used for bending a plate-like workpiece includes a lower die on which the workpiece is placed, and an upper die having a pressing surface formed to press the workpiece against the lower die. The lower die includes a lower movable part slidable in the same direction as a moving direction of the upper die, a reaction force generating member configured to elastically support the lower movable part from beneath, and receiving members located on both sides of the lower movable part. The pressing surface has an arc-shaped cross-section protruding toward the lower die and extends in a longitudinal direction of the workpiece. The maximum push-in position of the lower end portion of the pressing surface is deeper than a position lowered by a finished inner diameter dimension of the workpiece from an upper surface of the lower die.
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