High-Frequency Line Structure, Subassembly, Line Card, and Method for Manufacturing Line Structure
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United States of America Patent
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Issued Date -
Dec 15, 2022
app pub date -
Nov 13, 2019
filing date -
Nov 13, 2019
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Abstract
A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.
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