TEST SYSTEM AND TEST METHOD TO A WAFER
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United States of America Patent
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Issued Date -
Dec 15, 2022
app pub date -
Jun 11, 2021
filing date -
Jun 11, 2021
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Abstract
A test method is disclosed. The test method includes the following operations: transmitting from a first controller a first command by a network to a test apparatus; the test apparatus being disconnecting from a prober in response to the first command received by a control interface in the test apparatus; controlling, by the control interface, at least one operation of the prober on a wafer held by the prober or a probe through a first control signal that is generated by the test apparatus to the prober and associated with the second command; and testing, by the prober and the test apparatus, the wafer and outputting a test data of the wafer.
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